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    Characterization of the material properties of two FR4 printed circuit board laminates

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    13-01956.pdf (4.755Mb)
    Date
    2014-01-10
    Author
    Haugan, Espen Tunhøvd
    Dalsjø, Per
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    Abstract
    Most printed circuit boards are based on a laminate of weaved glass fiber cloth and epoxy. These laminates have so-called viscoelastic material properties. This means that properties such as elasticity and thermal expansion drastically change above a certain temperature, called the glass transition temperature. When selecting a laminate, the temperature range of the soldering process and the end application must therefore be taken into account. The objective of this work has been to increase our knowledge on laminates used in printed circuit boards by characterizing two FR4 laminates. This was done by measuring the storage and loss modulus, glass transition temperature, coefficient of thermal expansion and flexural strength. The effect of a typical soldering process was also investigated. The result was detailed material properties for the two laminates and an increased knowledge related to printed circuit board laminates in general. The work reported here was done as part of a summer internship.
     
    De fleste kretskort er bygget på et laminat av vevd glassfiberduk og epoksy. Disse laminatene har såkalte viskoelastiske materialegenskaper som vil si at materialets elastisitet og termiske utvidelse forandrer seg drastisk over en gitt temperatur, kalt glasstransisjonstemperaturen. Laminatet må derfor velges utifra temperaturområdet til loddeprosessen som benyttes og sluttapplikasjonen. Målet med dette arbeidet har vært å øke kompetansen relatert til laminatet i kretskort ved å karakterisere to FR4-laminat. Dette har blitt gjort ved å måle lagrings- og tapsmodulen, glasstransisjonstemperaturen, koeffisienten for termisk ekspansjon og bøyestyrken. Hvordan en typisk loddeprosess påvirker disse parameterne ble også undersøkt. Resultatet var detaljerte materialparametere for de to laminatene i tillegg til økt kompetanse på laminater for kretskort generelt. Arbeidet rapportert her ble utført som del av et sommerstudentengasjement.
     
    URI
    http://hdl.handle.net/20.500.12242/1012
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